Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/150870
Kind Code:
A1
Abstract:
The present invention comprises: a pair of direct current terminals (2 (2P, 2N)); semiconductor elements (3 (3U, 3L)) connected to an individual direct current terminal (2); a facing bus bar (4); and a sealing member (5). The facing bus bar (4) is disposed at a position adjacent to the pair of direct current terminals (2) in the thickness direction of the direct current terminals (2). An eddy current (i) is generated in the facing bus bar (4) as a current (I) flowing through the direct current terminals (2) changes with time. The sealing member (5) seals the pair of semiconductor elements (3) and the facing bus bar (4). A portion of the facing bus bar (4) is exposed from the sealing member (5).
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| WO/2022/059251 | SEMICONDUCTOR DEVICE |
| WO/2012/121344 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| WO/2019/035430 | SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE |
Inventors:
ARIMURA SEIKOH (JP)
TAKI HIROSHI (JP)
MASUZAWA TAKASHI (JP)
TAKI HIROSHI (JP)
MASUZAWA TAKASHI (JP)
Application Number:
PCT/JP2018/048159
Publication Date:
August 08, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18; H02M7/48
Foreign References:
| JP2017099231A | 2017-06-01 | |||
| JP2014086506A | 2014-05-12 | |||
| JPH1074886A | 1998-03-17 | |||
| JP2010287737A | 2010-12-24 | |||
| JP2016019319A | 2016-02-01 | |||
| JP2002373971A | 2002-12-26 |
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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