Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/171795
Kind Code:
A1
Abstract:
This semiconductor module comprises: a circuit board; a semiconductor chip which has a first electrode pad on a first surface, while having a second surface bonded to the circuit board, said second surface being on the reverse side of the first surface, and which has a lateral surface that intersects with the first surface and the second surface; an external terminal which is electrically connected to the first electrode pad; and an insulating member which affixes the external terminal. Since the insulating member is in contact with the lateral surface of the semiconductor chip at a plurality of portions, parallel shift and rotational shift of the semiconductor chip relative to the insulating member is limited in a plane that is parallel to the first surface; and the external terminal penetrates through the insulating member.
Inventors:
SAWADA KENICHI (JP)
SHINKAI JIRO (JP)
TANAKA SO (JP)
OOMORI HIROTAKA (JP)
SHINKAI JIRO (JP)
TANAKA SO (JP)
OOMORI HIROTAKA (JP)
Application Number:
PCT/JP2019/001793
Publication Date:
September 12, 2019
Filing Date:
January 22, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L23/48; H01L21/60; H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| WO2015016017A1 | 2015-02-05 | |||
| WO2013054408A1 | 2013-04-18 |
Foreign References:
| JP2018019110A | 2018-02-01 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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