Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/009970
Kind Code:
A1
Abstract:
This semiconductor module has: a first substrate; an electronic component that is mounted to the first substrate; a first cap that is provided to the first substrate and that includes an upper plate for covering the electronic component and a wall part for surrounding the periphery of the upper plate; a semiconductor element that is provided so as to oppose the upper plate and that has an area greater than the area of the first cap in a plan view from a direction perpendicular to the first substrate; and an adhesive member which is provided between the first cap and the semiconductor element and in which a fillet is formed with a skirt thereof expanding from the first cap toward the semiconductor element.
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Inventors:
OHITSU TOSHIKATSU (JP)
Application Number:
PCT/JP2020/012580
Publication Date:
January 21, 2021
Filing Date:
March 23, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H01L25/00; H03B5/32
Domestic Patent References:
| WO2009157208A1 | 2009-12-30 |
Foreign References:
| JP2004235310A | 2004-08-19 | |||
| JP2008219206A | 2008-09-18 | |||
| JP2010153966A | 2010-07-08 | |||
| JP2009027451A | 2009-02-05 | |||
| JP2005033755A | 2005-02-03 | |||
| JP2009165102A | 2009-07-23 | |||
| JP2008282941A | 2008-11-20 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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