Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/190683
Kind Code:
A1
Abstract:
This semiconductor module comprises: a first substrate having a principal plane; a flexible second substrate that includes a connection part which is connected to the first substrate and a gap forming part which overlaps the first substrate in a plan view of the principal plane when seen along a direction perpendicular to the principal plane, and which forms a gap between the first and the second substrates; a first semiconductor chip which is at least in part provided in the gap; and a second semiconductor chip which is provided on the side of the second substrate that is opposite the gap. The second substrate has a first electroconductive layer which is supplied with a reference potential, the first electroconductive layer at least in part overlapping the first and second semiconductor chips.
Inventors:
NAKAGAWA YOSHIKI (JP)
KATO TAKEHIKO (JP)
KATO TAKEHIKO (JP)
Application Number:
PCT/JP2023/012797
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020049989A1 | 2020-03-12 | |||
| WO2014178153A1 | 2014-11-06 |
Foreign References:
| JP2017092291A | 2017-05-25 | |||
| JP2021170702A | 2021-10-28 | |||
| JP2021097322A | 2021-06-24 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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