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Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/248999
Kind Code:
A1
Abstract:
A semiconductor module according to one aspect of the present disclosure comprises a semiconductor device, a cooling plate, and a flow path forming member. The cooling plate is provided on one main surface of the semiconductor device. The flow path forming member: is provided on the other main surface opposite to the one main surface of the semiconductor device; includes a bottom member abutting on the other main surface, and lateral members standing upright from opposing ends of the bottom member; and forms a flow path for a refrigerant.

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Inventors:
HONMA TOSHIKI (JP)
Application Number:
PCT/JP2023/022702
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
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Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
WO2019003718A12019-01-03
Foreign References:
JP2019102646A2019-06-24
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