Title:
SEMICONDUCTOR-MOUNTING RADIATION BASE PLATE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/217221
Kind Code:
A1
Abstract:
The invention solves the problem that, in prior art, since a semiconductor-mounting radiation base plate proceeds through a cooling step during casting by undergoing directional solidification, the metal structure thereof is formed into a coarse columnar crystals from the cooling side, leading to flaws in the fastening effects and radiation characteristics of the radiation base, and in the joined state of a semiconductor chip against a metal circuit layer.
This semiconductor-mounting radiation base plate comprises: an insulating substrate 12 having adhered thereto a metal circuit layer whereon a semiconductor chip is to be mounted; and a strength member 13 separated from the insulated substrate inside a radiation base, the radiation base being formed from a similar metal material to the metal circuit layer and adhered to the insulating substrate 12 in a similar manner to the metal circuit layer, sandwiching the insulating substrate 12 on the side facing away from the metal circuit layer. In this semiconductor-mounting radiation base plate, the crystal grains of the metal structure in one of the portions among the radiation base and the metal circuit layer is refined by a crystal-refining material 25 attached to the mold, thereby preventing a negative effect caused by the columnar crystal structure.
Inventors:
TANAKA KEISUKE (JP)
OYA DAISUKE (JP)
ISHIHARA MIKIO (JP)
IWASA TATSUYA (JP)
SAITO KOJI (JP)
WAKABAYASHI YUKI (JP)
OYA DAISUKE (JP)
ISHIHARA MIKIO (JP)
IWASA TATSUYA (JP)
SAITO KOJI (JP)
WAKABAYASHI YUKI (JP)
Application Number:
PCT/JP2017/019898
Publication Date:
December 21, 2017
Filing Date:
May 29, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; B22C3/00; B22D19/00; B22D27/18; B22D27/20; H01L23/12; H05K1/02
Foreign References:
| JP2008253996A | 2008-10-23 | |||
| JP2011166122A | 2011-08-25 | |||
| JP2014133240A | 2014-07-24 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Download PDF: