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Title:
SEMICONDUCTOR NANOPARTICLES COMPOSED OF AGAUS-BASED MULTI-ELEMENT COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/149392
Kind Code:
A1
Abstract:
The present invention relates to semiconductor nanoparticles composed of a compound containing Ag, Au, S, and a metal M as essential constituent elements. In the present invention, the metal M is at least one of Al, Ga, In, Tl, Zn, Cd, Hg, and Cu, and the total content value for Ag, Au, S, and the metal M in the compound is 95 mass% or greater. Additionally, the ratio (x/(x+y)) of the number of atoms of Ag to the total of the number x of atoms of Ag and the number y of atoms of Au is preferably 0.50-0.88 inclusive. These semiconductor nanoparticles have biocompatibility as well as suitable light emission/absorption characteristics.

Inventors:
TORIMOTO TSUKASA (JP)
KAMEYAMA TATSUYA (JP)
HASEGAWA MARIKO (JP)
MIYAMAE CHIE (JP)
SATO HIROKI (JP)
OHSHIMA YUUSUKE (JP)
KIKUCHI SHOJIRO (JP)
Application Number:
PCT/JP2023/002840
Publication Date:
August 10, 2023
Filing Date:
January 30, 2023
Export Citation:
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Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
TANAKA PRECIOUS METAL IND (JP)
International Classes:
C01G7/00; B82Y20/00; B82Y30/00; C01G5/00; C09K11/08; C09K11/58; C09K11/62; C09K11/64; C09K11/89
Domestic Patent References:
WO2021182412A12021-09-16
Foreign References:
JP2018044142A2018-03-22
CN112536047A2021-03-23
Attorney, Agent or Firm:
ORIGINATE IP (JP)
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