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Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2008/029858
Kind Code:
A1
Abstract:
A semiconductor package (10) comprises a main body (18) having a semiconductor element housing (16) for housing a basic circuit including a semiconductor element (14), a plurality of external connection terminal members (20) projecting from the main body, and a cooling structure (28) for removing heat generated by the element from the main body. The cooling structure comprises a refrigerant passage (30) including a refrigerant supply port (30a) to which a refrigerant is supplied, a refrigerant passing space (30b) allowing the refrigerant to pass on the back surface side of the basic circuit housed in the adjacent housing, and a refrigerant discharge port (30c) for discharging the refrigerant from the passing space. A semiconductor package assembly (12) includes a package supporting body (38) for supporting the package and having a refrigerant circulation structure (40) in which the refrigerant is supplied through the supply port to the passage of the main body and the supplied refrigerant is collected through the discharge port.

Inventors:
HASEGAWA, Tsuyoshi (())
Application Number:
JP2007/067340
Publication Date:
March 13, 2008
Filing Date:
September 05, 2007
Export Citation:
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Assignee:
KABUSHIKI KAISHA TOSHIBA (1-1 Shibaura 1-chome, Minato-ku Tokyo, 01, 1058001, JP)
株式会社 東芝 (〒01 東京都港区芝浦一丁目1番1号 Tokyo, 1058001, JP)
International Classes:
H01L23/473
Domestic Patent References:
WO1995008844A1
Foreign References:
JPH09307040A
JP2001308246A
JP2004103936A
FR2500215A1
JP2004103936A
JP2001308246A
JPH09307040A
Other References:
See also references of EP 2061079A1
Attorney, Agent or Firm:
SUZUYE, Takehiko et al. (1-12-9 Toranomon,Minato-ku, Tokyo 01, 1050001, JP)
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