Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND TRANSMISSION/RECEPTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/107588
Kind Code:
A1
Abstract:
There has been a problem involving the occurrence of a high-order mode in a transmission path of transmission signals in conventional semiconductor devices. According to one embodiment of the present invention, a semiconductor package has: a dielectric substrate having a semiconductor chip mounted in a cavity that is provided therein; a first electrode, which is provided on a first surface of the dielectric substrate, and which is electrically connected to a ground pattern on a mounting substrate; a coaxial waveguide conversion section (46), which is formed by internally-inserted wiring that is formed using a plurality of wiring layers in the dielectric substrate, and which alternately converts a transmission signal transmitted through a micro strip line connected to the semiconductor chip, and a transmission signal transmitted through the waveguide; and second electrodes (55a, 55b), which are provided on a second surface facing the first surface of the dielectric substrate, and which applies a ground potential to the waveguide that is disposed to cover the coaxial waveguide conversion section (46), said ground potential having been supplied form the ground pattern.

Inventors:
KUWABARA, Toshihide (7-1 Shiba 5-chome, Minato-k, Tokyo 01, 〒1088001, JP)
Application Number:
JP2014/006046
Publication Date:
July 23, 2015
Filing Date:
December 03, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORPORATION (7-1 Shiba 5-chome, Minato-ku Tokyo, 01, 〒1088001, JP)
International Classes:
H01P5/107; H01L23/02; H01L23/12; H01P5/08
Domestic Patent References:
WO2014068811A12014-05-08
Foreign References:
JPH08274513A1996-10-18
JPH1074863A1998-03-17
JP2002368561A2002-12-20
JP2003133816A2003-05-09
US6573808B12003-06-03
Other References:
MEHTA, S.S. ET AL.: "An 802.11g WLAN SoC", IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 40, no. 12, December 2005 (2005-12-01), pages 2483 - 2491
Attorney, Agent or Firm:
IEIRI, Takeshi (HIBIKI IP Law Firm, Asahi Bldg. 10th Floor 3-33-8, Tsuruya-cho, Kanagawa-ku, Yokohama-sh, Kanagawa 35, 〒2210835, JP)
Download PDF:



 
Previous Patent: LEAD-ACID BATTERY

Next Patent: VEHICULAR HEAT MANAGEMENT SYSTEM