Title:
SEMICONDUCTOR PACKAGE, AND DISPLAY
Document Type and Number:
WIPO Patent Application WO/2008/041507
Kind Code:
A1
Abstract:
In a tape carrier type semiconductor package having an interposer substrate,
connection terminals and wiring are provided on the interposer substrate and
upsizing of a semiconductor package incident to upsizing of the interposer substrate
is inevitable as the number of connection terminals increases. The inventive
semiconductor package where a semiconductor chip is connected with a film substrate
through the interposer substrate, characterized in that the semiconductor
chip is provided with a plurality of terminals respectively on two opposing sides
and connected, on the interposer substrate, while being shifted from the center
of the interposer substrate to the side of one of two sides having a fewer terminals.
Inventors:
KATOH TATSUYA
KUDOSE SATORU
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
KUDOSE SATORU
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
Application Number:
PCT/JP2007/068359
Publication Date:
April 10, 2008
Filing Date:
September 21, 2007
Export Citation:
Assignee:
SHARP KK (JP)
KATOH TATSUYA
KUDOSE SATORU
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
KATOH TATSUYA
KUDOSE SATORU
NAKAGAWA TOMOKATSU
TSUKAO TOSHIYA
International Classes:
H01L23/12; G02F1/1345; H01L21/60; H01L23/14
Foreign References:
JP2006023469A | 2006-01-26 | |||
JP2004207566A | 2004-07-22 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita,Kita-k, Osaka-shi Osaka 41, JP)
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