Title:
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/006297
Kind Code:
A1
Abstract:
The present invention comprises: a semiconductor chip (30); a heat dissipation member (20) on which the semiconductor chip (30) is mounted; and a sealing member (60) for sealing the semiconductor chip (30). The sealing member (60) is made of a liquid crystal polymer.
Inventors:
YAMAGUCHI AKIHIRO (JP)
IMAIZUMI NORIHISA (JP)
KAMIKOMAKI RYUMA (JP)
KONDOH KOUJI (JP)
MIYANO HIROTAKA (JP)
YOKOCHI TOMOHIRO (JP)
MASUDA GENTAROU (JP)
IMAIZUMI NORIHISA (JP)
KAMIKOMAKI RYUMA (JP)
KONDOH KOUJI (JP)
MIYANO HIROTAKA (JP)
YOKOCHI TOMOHIRO (JP)
MASUDA GENTAROU (JP)
Application Number:
PCT/JP2020/026714
Publication Date:
January 14, 2021
Filing Date:
July 08, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; H01L23/31; H01L25/07; H01L25/18; H05K3/46
Foreign References:
| JP2007235004A | 2007-09-13 | |||
| JP2007157863A | 2007-06-21 | |||
| JP2015119048A | 2015-06-25 | |||
| JP2008066762A | 2008-03-21 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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