SEMICONDUCTOR PACKAGE, ELECTRONIC PARTS, AND ELECTRONIC DEVICE

Title:

SEMICONDUCTOR PACKAGE, ELECTRONIC PARTS, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2007/058134

Kind Code:

A1

Abstract:

Even if a substrate having a semiconductor package mounted thereon is curved, the stress on an electric connection is released to eliminate a poor connection thereby to improve a connection reliability. A semiconductor chip (10) has an electrode (11) on its second face (10b). Semiconductor blocks (20) are arranged at two portions on the peripheral edge of a first face (10a) of the semiconductor chip (10), and can be bent and warped. An interposer (30) is arranged with respect to the semiconductor chip (10) through and across the support blocks (20), and has a wiring pattern in a flexible resin film. The interposer (30) is folded back at its two end portions to the side of the second face (10b) of the semiconductor chip (10), and has its wiring pattern connected electrically with the electrode (11) of the semiconductor chip (10).

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Inventors:

MIKAMI, Nobuhiro (7-1 Shiba 5-chome, Minato-k, Tokyo 01, 1088001, JP)
三上伸弘 (〒01 東京都港区芝五丁目７番１号日本電気株式会社内 Tokyo, 1088001, JP)
WATANABE, Shinji (7-1 Shiba 5-chome, Minato-k, Tokyo 01, 1088001, JP)
渡邉真司 (〒01 東京都港区芝五丁目７番１号日本電気株式会社内 Tokyo, 1088001, JP)

Application Number:

JP2006/322524

Publication Date:

May 24, 2007

Filing Date:

November 13, 2006

Export Citation:

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Assignee:

NEC CORPORATION (7-1 Shiba 5-chome, Minato-ku Tokyo, 01, 1088001, JP)
日本電気株式会社 (〒01 東京都港区芝五丁目７番１号 Tokyo, 1088001, JP)
MIKAMI, Nobuhiro (7-1 Shiba 5-chome, Minato-k, Tokyo 01, 1088001, JP)
三上伸弘 (〒01 東京都港区芝五丁目７番１号日本電気株式会社内 Tokyo, 1088001, JP)
WATANABE, Shinji (7-1 Shiba 5-chome, Minato-k, Tokyo 01, 1088001, JP)

International Classes:

H01L23/12

Attorney, Agent or Firm:

KATO, Asamichi (daVinci BOSEI 7th Floor,, 20-12 Shin-Yokohama 3-chome,, Kohoku-ku, Yokohama-sh, Kanagawa 33, 2220033, JP)

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