Title:
SEMICONDUCTOR PACKAGE, METHOD OF PRODUCING THE SAME, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/058073
Kind Code:
A1
Abstract:
A camera module (1) has a lens member (20) attached to a semiconductor package (10).
The semiconductor package (10) has an image sensor (11) mounted on a wiring board
(13) and a wire (15) for electrically connecting the wiring board (13) and the
image sensor (11). The image sensor (11) is sealed together with the wire (15) by
mold resin (14). A step (18) is formed at the perimeter edge of the surface of the
mold resin (14), and the semiconductor package (10) and the lens member (20) are
joined by fitting to each other the step (18) and a projection (23) of the lens holder
(22). Accordingly, the semiconductor package and the mounting component joint
to the package are highly precisely aligned with each other, and the semiconductor package
that can be reduced in side is realized.
Inventors:
ISHIKAWA KAZUHIRO
NISHIDA KATSUITSU
FUJITA KAZUYA
NAKAHASHI TAKAHIRO
NISHIDA KATSUITSU
FUJITA KAZUYA
NAKAHASHI TAKAHIRO
Application Number:
PCT/JP2006/321898
Publication Date:
May 24, 2007
Filing Date:
November 01, 2006
Export Citation:
Assignee:
SHARP KK (JP)
ISHIKAWA KAZUHIRO
NISHIDA KATSUITSU
FUJITA KAZUYA
NAKAHASHI TAKAHIRO
ISHIKAWA KAZUHIRO
NISHIDA KATSUITSU
FUJITA KAZUYA
NAKAHASHI TAKAHIRO
International Classes:
H01L23/28; H01L27/14
Foreign References:
| JP2002134661A | 2002-05-10 | |||
| JPS55175249U | 1980-12-16 | |||
| JP2004296453A | 2004-10-21 | |||
| JP2005184630A | 2005-07-07 | |||
| JP2003110946A | 2003-04-11 | |||
| JP2006344898A | 2006-12-21 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita, Kita-k, Osaka-shi Osaka 41, JP)
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