Title:
SEMICONDUCTOR PACKAGE AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2014/068811
Kind Code:
A1
Abstract:
Disclosed is a mounting structure of a semiconductor package, said mounting structure being provided with a substrate (200) and a semiconductor package (100). An opening (210) connected to the hollow space of a waveguide (310) is formed in the substrate (200). The semiconductor package (100) is mounted on the substrate (200). The semiconductor package (100) is provided with a semiconductor device (110), and a probe (152) connected to the semiconductor device (110). The opening (210) is provided with a portion overlapping the probe (152), and a portion not overlapping the semiconductor package (100).
Inventors:
KUWABARA TOSHIHIDE (JP)
Application Number:
PCT/JP2013/003956
Publication Date:
May 08, 2014
Filing Date:
June 25, 2013
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01P5/107; H01L23/12
Foreign References:
| JPH06132708A | 1994-05-13 | |||
| US20080111654A1 | 2008-05-15 | |||
| JP2010098609A | 2010-04-30 | |||
| JP2008524887A | 2008-07-10 | |||
| JP2003309404A | 2003-10-31 | |||
| JPH11243307A | 1999-09-07 | |||
| JPH11340414A | 1999-12-10 |
Other References:
See also references of EP 2916384A4
Attorney, Agent or Firm:
IEIRI, Takeshi (JP)
House ON 健 (JP)
House ON 健 (JP)
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