Title:
SEMICONDUCTOR PACKAGE POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/050481
Kind Code:
A1
Abstract:
Disclosed is a semiconductor package polyimide film, which can prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and can be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.
Inventors:
LEE KYE UNG (KR)
KIM JUNG HEE (KR)
KIM SUNG SU (KR)
PARK HO YOUNG (KR)
LEE TAE SEOK (KR)
KIM JUNG HEE (KR)
KIM SUNG SU (KR)
PARK HO YOUNG (KR)
LEE TAE SEOK (KR)
Application Number:
PCT/KR2019/007342
Publication Date:
March 12, 2020
Filing Date:
June 18, 2019
Export Citation:
Assignee:
IPI TECH INC (KR)
International Classes:
C08J7/04; C08J5/18; C09D7/61; C09D179/08; H01L23/29
Foreign References:
| KR20170122661A | 2017-11-06 | |||
| JP2005313407A | 2005-11-10 | |||
| JPH091723A | 1997-01-07 | |||
| KR20070075356A | 2007-07-18 | |||
| KR20160024878A | 2016-03-07 | |||
| KR101966958B1 | 2019-04-09 |
Attorney, Agent or Firm:
DAE-A INTELLECTUAL PROPERTY CONSULTING (KR)
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