Title:
SEMICONDUCTOR PACKAGE SPUTTERING METHOD USING LIQUID ADHESIVE FOR ELECTROMAGNETIC INTERFERENCE SHIELDING AND SPUTTERING APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/182816
Kind Code:
A1
Abstract:
The present invention relates to a sputtering method using a liquid adhesive and a sputtering apparatus therefor. The sputtering method for sputtering a semiconductor package using a liquid adhesive according to the present invention comprises the steps of: (a) mounting a tray; (b) applying a liquid adhesive to the tray; (c) curing the liquid adhesive; (d) loading a plurality of semiconductor packages on the tray such that the plurality of semiconductor packages are attached to the liquid adhesive; (e) performing sputtering on the semiconductor packages; (f) unloading the semiconductor packages from the tray; and (g) removing the liquid adhesive from the tray.
Inventors:
KIM CHANG SU (KR)
KIM JONG WOON (KR)
LEE MIN JIN (KR)
KIM JONG WOON (KR)
LEE MIN JIN (KR)
Application Number:
PCT/KR2014/006224
Publication Date:
December 03, 2015
Filing Date:
July 10, 2014
Export Citation:
Assignee:
CNI TECHNOLOGY INC (KR)
International Classes:
H01L23/60; H01L21/203
Foreign References:
| JPH10144703A | 1998-05-29 | |||
| KR20040049473A | 2004-06-12 | |||
| KR20050122482A | 2005-12-29 | |||
| KR100214552B1 | 1999-08-02 |
Attorney, Agent or Firm:
LEE, JOON SUNG (KR)
이준성 (KR)
이준성 (KR)
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