Title:
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/060329
Kind Code:
A1
Abstract:
A semiconductor package structure and a manufacturing method therefor. The semiconductor package structure (100) comprises: a first substrate (1); a processor module (4) and a chip stack structure (5) which are both arranged on a first flat surface of the first substrate (1), the chip stack structure (5) comprising: a first semiconductor chip (51) connected to the first substrate (1), and a second semiconductor chip stack structure (52) located on the first semiconductor chip (51) and comprising a plurality of second semiconductor chips (521) successively stacked in a first direction, the first direction being parallel to the first flat surface of the first substrate (1); a second substrate (2) arranged in a second direction and electrically connected to the second semiconductor chip stack structure (52), a first end in the second direction being provided with a first connection apparatus (21), and the second direction being perpendicular to the first flat surface of the first substrate (1); and a third substrate (3) connected to a second flat surface of the first substrate (1), a first end in the second direction being provided with a second connection apparatus (31), and the first connection apparatus (21) and the second connection apparatus (31) being both used for flexible connection. An integrated replaceable data processing system can be formed.
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Inventors:
JI HONGKAI (CN)
Application Number:
PCT/CN2022/124198
Publication Date:
March 28, 2024
Filing Date:
October 09, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/52; H01L21/768
Foreign References:
| CN109755215A | 2019-05-14 | |||
| CN110299354A | 2019-10-01 | |||
| CN110875278A | 2020-03-10 | |||
| CN114400213A | 2022-04-26 | |||
| US20120168930A1 | 2012-07-05 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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