Title:
SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2024/035176
Kind Code:
A1
Abstract:
A semiconductor package substrate according to an embodiment comprises: an insulating layer having a top surface and a bottom surface; and a through electrode penetrating the top surface and the bottom surface of the insulating layer, wherein a side surface of the through electrode includes a concave part and a convex part alternately provided in a vertical direction. In addition, a semiconductor package substrate according to another embodiment comprises: an insulating layer having a top surface and a bottom surface; and a through-hole penetrating the top surface and the bottom surface of the insulating layer, wherein a side wall of the through-hole includes a concave part and a convex part alternately provided in the vertical direction.
Inventors:
BAE JIN SOO (KR)
NA YONG SEOK (KR)
JEONG HEON (KR)
KWON SOON GYU (KR)
MYEONG SE HO (KR)
HWANG JUNG HO (KR)
NA YONG SEOK (KR)
JEONG HEON (KR)
KWON SOON GYU (KR)
MYEONG SE HO (KR)
HWANG JUNG HO (KR)
Application Number:
PCT/KR2023/011868
Publication Date:
February 15, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/11; H01L23/00; H01L23/12; H01L23/498; H01L23/528; H01L25/065; H05K1/18
Foreign References:
| CN208016126U | 2018-10-26 | |||
| JPH1093247A | 1998-04-10 | |||
| KR20210143997A | 2021-11-30 | |||
| KR20160123525A | 2016-10-26 | |||
| JP2009054689A | 2009-03-12 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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