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Title:
SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/036770
Kind Code:
A1
Abstract:
A semiconductor package substrate (300), a manufacturing method for the semiconductor package substrate (300), and a semiconductor package structure (1300). The semiconductor package substrate (300) comprises: a substrate (310); and a gold finger body (320) formed on the substrate (310), wherein a recessed area is formed on the surface of the gold finger body (320), and is used for press fitting of a gold wire. The bonding force of solder joints between the gold finger and the gold wire can be improved.

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Inventors:
WANG HAILIN (CN)
Application Number:
PCT/CN2022/130398
Publication Date:
February 22, 2024
Filing Date:
November 07, 2022
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H05K1/11
Foreign References:
CN205755053U2016-11-30
US20100126763A12010-05-27
CN102556938A2012-07-11
CN203942697U2014-11-12
CN209420009U2019-09-20
JP2000114680A2000-04-21
JP2011210930A2011-10-20
US20050156303A12005-07-21
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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