Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/066791
Kind Code:
A1
Abstract:
This semiconductor package is provided with a semiconductor integrated circuit chip, which has an input matching circuit that has a high frequency signal input and is disposed in a die-bond region, and lead terminals disposed at the periphery of the die-bond region. The semiconductor package also has each of the terminals of the semiconductor integrated circuit and each of the lead terminals connected by bond wires. The semiconductor integrated circuit chip is disposed in a position shifted from the center of the die-bond region to a high frequency input terminal side that has the lead terminals for inputting the high frequency signal to the input matching circuit and/or a ground terminal side that has the lead terminals used for ground connections for the input matching circuit.
Inventors:
KOUTANI Masato (())
Application Number:
JP2011/052088
Publication Date:
May 24, 2012
Filing Date:
February 02, 2011
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-Cho Abeno-Ku, Osaka-Sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
H01L23/12; H04B1/18
Attorney, Agent or Firm:
SANO Shizuo (Tenmabashi-Yachiyo Bldg. Bekkan, 2-6 Tenmabashi-Kyomachi, Chuo-Ku, Osaka-Sh, Osaka 32, 〒5400032, JP)
Claims:
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