Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2013/150616
Kind Code:
A1
Abstract:
Wiring (2, 3) is furnished on the upper surface of a laminated ceramic substrate (1). A ceramic block (6) is furnished on the laminated ceramic substrate (1). A plurality of electronic components, including a semiconductor laser (7), are furnished on the surface of the ceramic block (6). Wiring (11, 12) furnished on the surface of the ceramic block (6) connects some of the plurality of electronic components to the wiring (2, 3). A metal cap (16) outfitted with a glass window (15) is furnished on the laminated ceramic substrate (1), and this metal ring (14) covers the ceramic block (6) and the plurality of electronic components such as the semiconductor laser (7).
Inventors:
MATSUSUE AKIHIRO (JP)
Application Number:
PCT/JP2012/059190
Publication Date:
October 10, 2013
Filing Date:
April 04, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MATSUSUE AKIHIRO (JP)
MATSUSUE AKIHIRO (JP)
International Classes:
H01L23/02; H01L31/02; H01S5/02315
Foreign References:
| JP2010129833A | 2010-06-10 | |||
| JP2004363550A | 2004-12-24 | |||
| JP2004221095A | 2004-08-05 | |||
| JP2007043073A | 2007-02-15 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Takada 守 (JP)
Takada 守 (JP)
Download PDF: