Title:
SEMICONDUCTOR PACKAGES, LEAD-CONTAINING SOLDERS AND ANODES AND METHODS OF REMOVING ALPHA-EMITTERS FROM MATERIALS
Document Type and Number:
WIPO Patent Application WO2004034427
Kind Code:
B1
Abstract:
The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
Inventors:
WEISER MARTIN W
DEAN NANCY F
CLARK BRETT M
BOSSIO MICHAEL J
FLEMING RONALD H
FLINT JAMES P
DEAN NANCY F
CLARK BRETT M
BOSSIO MICHAEL J
FLEMING RONALD H
FLINT JAMES P
Application Number:
PCT/US2003/030783
Publication Date:
August 05, 2004
Filing Date:
September 25, 2003
Export Citation:
Assignee:
HONEYWELL INT INC (US)
International Classes:
B23K35/02; C25C1/18; H01L23/485; H01L23/498; B23K35/26; C22B13/06; H01L23/31; H05K3/34; (IPC1-7): C25C1/18; B23K1/08; C25D15/00; H01L23/48
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