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Patent Searching and Data


Title:
SEMICONDUCTOR PACKAGING STRUCTURE COMPRISING METAL PLATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/026035
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor packaging comprising a metal plate, the semiconductor packaging structure comprising: a metal plate having a groove for removal of an electronic element; an electronic element; and a silicon-based adhesive for allowing the electronic element to adhere to the metal plate, wherein the silicone-based adhesive satisfies all of formulas 1 to 3 below: [Formula 1] 1,200 ≤ viscosity (cP) ≤ 1,800; [Formula 2] volatile condensable mass ≤ 0.01 wt%; and [Formula 3] total mass loss ≤ 0.05 wt% (Formula 1 represents a value measured before curing and Formulas 2 and 3 represent values measured after curing; and Formula 1 is measured according to the ASTM D1084 test method and Formulas 2 and 3 are measured according to the ASTM E595 test method).

Inventors:
OH, Guenyoung (411-604, 32 Noeunseo-ro 210beon-gil,Yuseong-gu, Daejeon, 34082, KR)
YU, Joohye (411-604, 32 Noeunseo-ro 210beon-gil,Yuseong-gu, Daejeon, 34082, KR)
Application Number:
KR2016/008631
Publication Date:
February 08, 2018
Filing Date:
August 05, 2016
Export Citation:
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Assignee:
PICOPACK CO., LTD. (20696, Gajeongbuk-roYuseong-gu, Daejeon, 34111, KR)
International Classes:
H01L23/00; H01L23/522
Attorney, Agent or Firm:
AHN, Jaeyul (2F47, Dunsanseo-roSeo-gu, Daejeon, 35234, KR)
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