Title:
SEMICONDUCTOR POWER MODULE, ELECTRIC MOTOR CONTROLLER AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2023/083320
Kind Code:
A1
Abstract:
A semiconductor power module, an electric motor controller and a vehicle. The semiconductor power module comprises: a substrate; a first conduction region, a second conduction region, a third conduction region and a fourth conduction region, which are arranged on the substrate, wherein the first conduction region and the second conduction region extend in a first direction of the substrate and are arranged in a second direction of the substrate, the third conduction region and the fourth conduction region are located between the first conduction region and the second conduction region and are arranged in the first direction, the first conduction region, the second conduction region and the third conduction region are used for transmitting direct-current signals, and the fourth conduction region is used for transmitting alternating-current signals; and a first power chip, a second power chip and a third power chip.
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Inventors:
ZHOU YUQI (CN)
LIU CHUNJIANG (CN)
ZHANG JIANLI (CN)
LIU CHUNJIANG (CN)
ZHANG JIANLI (CN)
Application Number:
PCT/CN2022/131480
Publication Date:
May 19, 2023
Filing Date:
November 11, 2022
Export Citation:
Assignee:
BYD SEMICONDUCTOR COMPANY LTD (CN)
International Classes:
H01L25/11; H02M7/48; H05K7/20
Foreign References:
| CN111696976A | 2020-09-22 | |||
| CN113192925A | 2021-07-30 | |||
| CN110797328A | 2020-02-14 | |||
| JP2017055610A | 2017-03-16 | |||
| CN111508916A | 2020-08-07 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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