Title:
SEMICONDUCTOR POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/220721
Kind Code:
A1
Abstract:
This semiconductor power module is configured by being provided with: a first electrode on which a plurality of rows of element arrays are mounted while being arranged in the Y direction, the element arrays each being composed of a plurality of semiconductor elements disposed in the X direction; a first main wiring connected to each of the element arrays mounted on the first electrode; a first sensor mounted on a first detection target element which is a semiconductor element that is least influenced by the combined inductance of the first main wiring, among the plurality of rows of element arrays mounted on the first electrode; a first control terminal disposed on the first electrode; and a control substrate for controlling a current flowing through the first detection target element on the basis of the detection result of the first sensor which has been acquired through the first control terminal.
Inventors:
TANI MASAKAZU (JP)
Application Number:
PCT/JP2017/020124
Publication Date:
December 06, 2018
Filing Date:
May 30, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/58; H01L25/07; H01L25/18; H02M1/00; H02M7/48
Domestic Patent References:
| WO2017056176A1 | 2017-04-06 |
Foreign References:
| JP2006041407A | 2006-02-09 | |||
| JP2003324179A | 2003-11-14 | |||
| JP2009141150A | 2009-06-25 | |||
| JP2000353778A | 2000-12-19 | |||
| JP3194353B2 | 2001-07-30 |
Other References:
See also references of EP 3633722A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Download PDF: