Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2019/107680
Kind Code:
A1
Abstract:
Disclosed is a semiconductor pressure sensor. The semiconductor pressure sensor according to an embodiment of the present invention includes: five connection pads which are each made of a conductive material and have a plate shape, and which are arrayed in parallel to each other; and four semiconductor resistor units which connect one pair of connection pads among the connection pads and have resistance values that change in proportion to changes in length caused by the external pressure, wherein the five connection pads include a power supply pad, a first output voltage pad, a first ground pad, a second output voltage pad, and a second ground pad.
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Inventors:
NOH SANG SOO (KR)
LEE EUNG AHN (KR)
YOO SUNG HO (KR)
KIM JEONG JU (KR)
KIM KYOUNG HUN (KR)
LEE EUNG AHN (KR)
YOO SUNG HO (KR)
KIM JEONG JU (KR)
KIM KYOUNG HUN (KR)
Application Number:
PCT/KR2018/005655
Publication Date:
June 06, 2019
Filing Date:
May 17, 2018
Export Citation:
Assignee:
DAEYANG ELECTRIC CO LTD (KR)
International Classes:
H01L41/113; G01L1/22; H01L41/047
Foreign References:
| JP2012127793A | 2012-07-05 | |||
| CN106768517A | 2017-05-31 | |||
| KR20160098353A | 2016-08-18 | |||
| KR20110088173A | 2011-08-03 | |||
| KR20100069168A | 2010-06-24 |
Other References:
See also references of EP 3518300A4
Attorney, Agent or Firm:
RYU, Won Rim (KR)
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