Title:
SEMICONDUCTOR PROCESS CHAMBER
Document Type and Number:
WIPO Patent Application WO/2022/151939
Kind Code:
A1
Abstract:
Disclosed in the present invention is a semiconductor process chamber, comprising a chamber, a housing, a dielectric window, a coil, a hot air hood, and an air passage structure. The housing covers an opening; the dielectric window is arranged in the housing and located above the opening; the coil is arranged on the inner top wall of the housing; the hot air hood is located in the housing; the air passage structure is fixedly connected to the housing; the air passage structure has air passages; and ventilation ends of the air passages are located outside the housing, and adapting ends of the air passages are located inside the housing and communicated with air passage openings of the hot air hood. In the semiconductor process chamber disclosed in the present invention, the hot air hood is directly fixed on the dielectric window, and a clearance gap is formed between the hot air hood and the inner top wall of the housing, such that the hot air hood and the housing can be prevented from pushing against each other, thereby preventing changes in the coil distribution structure caused by the deformation of the top wall of the housing due to push of the hot air hood, thus ensuring uniformity of the distribution of ions and free radicals in plasma.
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Inventors:
LI YAN (CN)
GUO SHIXUAN (CN)
MAO XINGFEI (CN)
GUO SHIXUAN (CN)
MAO XINGFEI (CN)
Application Number:
PCT/CN2021/140702
Publication Date:
July 21, 2022
Filing Date:
December 23, 2021
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01J37/305; H01J37/32; H01L21/3065
Foreign References:
| CN112820616A | 2021-05-18 | |||
| US20110039417A1 | 2011-02-17 | |||
| US5342472A | 1994-08-30 | |||
| CN105826155A | 2016-08-03 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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