Title:
SEMICONDUCTOR PROCESSING LIQUID, PROCESSING METHOD FOR OBJECT TO BE PROCESSED, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/014220
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a semiconductor processing liquid which imparts excellent anticorrosion properties to the metal in an object containing at least one metal selected from the group consisting of Cu and Co when brought into contact therewith, and with which defects are less likely to remain on the surface of the object to be processed after washing the object with water subsequent to the contact; a processing method for an object to be processed; and a manufacturing method for an electronic device. A semiconductor processing liquid according to the present invention contains: at least one purine compound selected from the group consisting of purines and purine derivatives; at least one specific compound selected from the group consisting of organic sulfonic acid compounds having at most 10 carbon atoms, sulfuric acid, and salts thereof; and water. The semiconductor processing liquid has a pH of greater than 7.0.
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Inventors:
YAMADA SHIMPEI (JP)
KAMIMURA TETSUYA (JP)
MIZUTANI ATSUSHI (JP)
SHIGENOI YUTA (JP)
KAMIMURA TETSUYA (JP)
MIZUTANI ATSUSHI (JP)
SHIGENOI YUTA (JP)
Application Number:
PCT/JP2023/022080
Publication Date:
January 18, 2024
Filing Date:
June 14, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C11D7/32; H01L21/304; C11D17/08
Foreign References:
| JP2016138282A | 2016-08-04 | |||
| JP2018507540A | 2018-03-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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