Title:
SEMICONDUCTOR PROCESSING LIQUID, METHOD FOR PROCESSING OBJECT TO BE PROCESSED, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/014224
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a semiconductor processing liquid which imparts, when in contact with an object containing at least one metal selected from the group consisting of Cu and Co, excellent anticorrosion properties to the metal, and also has excellent washability for organic residues on the surface of the object to be processed; a method for processing an object to be processed; and a method for manufacturing an electronic device. A processing liquid according to the present invention contains a purine compound and an amine compound, wherein: the purine compound includes at least one selected from the group consisting of purine and purine derivatives; the amine compound includes at least two compounds, that is, one amine compound A and one or more amine compounds B different from the amine compound A; the amine compound A is a tertiary amine compound; and the mass ratio of the content of the purine compound to the content of the amine compound is 0.0001-0.1.
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Inventors:
SHIGENOI YUTA (JP)
KAMIMURA TETSUYA (JP)
MIZUTANI ATSUSHI (JP)
YAMADA SHIMPEI (JP)
KAMIMURA TETSUYA (JP)
MIZUTANI ATSUSHI (JP)
YAMADA SHIMPEI (JP)
Application Number:
PCT/JP2023/022277
Publication Date:
January 18, 2024
Filing Date:
June 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C11D7/32; H01L21/304; C11D17/08
Foreign References:
| JP2016138282A | 2016-08-04 | |||
| JP2018507540A | 2018-03-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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