Title:
SEMICONDUCTOR-PROCESSING PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2015/080188
Kind Code:
A1
Abstract:
Provided is a semiconductor-processing pressure-sensitive adhesive tape provided with strong adhesion necessary when physical/mechanical peeling of a support member is to be performed, in which even if a washing fluid for washing away adhesive residue left over from when the support member was bonded to the semiconductor wafer comes into contact with a tackifier, the tackifier does not dissolve and contaminate the semiconductor element. The semiconductor-processing pressure-sensitive adhesive tape admits a laser necessary for stealth dicing such that the laser beam is radiated on the semiconductor wafer to form a modified layer, and the semiconductor wafer can be separated into semiconductor chips. This semiconductor-processing pressure-sensitive adhesive tape has a radiation-curable tackifier layer formed on at least one surface of a base material resin film, the contact angle of the pressure-sensitive adhesive layer to methyl isobutyl ketone prior to the pressure-sensitive adhesive layer being irradiated is 25.1° to 60°, and the parallel beam transmittance of light at a wavelength of 1064 nm incident from the base material resin film side is 88% or greater and less than 100%.
Inventors:
TAMAGAWA YURI (JP)
HATTORI SATOSHI (JP)
YABUKI AKIRA (JP)
HATTORI SATOSHI (JP)
YABUKI AKIRA (JP)
Application Number:
PCT/JP2014/081333
Publication Date:
June 04, 2015
Filing Date:
November 27, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; C09J7/20; C09J127/12; C09J183/10; C09J201/00; H01L21/304
Domestic Patent References:
| WO2006129458A1 | 2006-12-07 | |||
| WO2013061925A1 | 2013-05-02 |
Foreign References:
| JP2013239595A | 2013-11-28 | |||
| JP2007284577A | 2007-11-01 | |||
| JP2011139042A | 2011-07-14 | |||
| JPH06349799A | 1994-12-22 | |||
| JP2009161588A | 2009-07-23 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
Matsushita 亮 (JP)
Matsushita 亮 (JP)
Download PDF:
Previous Patent: DOOR CHECKING DEVICE
Next Patent: RADICAL POLYMERIZATION INITIATOR AND METHOD FOR PRODUCING POLYMERS
Next Patent: RADICAL POLYMERIZATION INITIATOR AND METHOD FOR PRODUCING POLYMERS