Title:
SEMICONDUCTOR PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2017/150018
Kind Code:
A1
Abstract:
Provided is a semiconductor processing sheet provided with a base film and a pressure-sensitive adhesive layer laminated on at least one side of the base film, the semiconductor processing sheet being characterized in that the base film contains a vinyl chloride-based resin and an adipate ester-based plasticizer and a terephthalate ester-based plasticizer as plasticizers and the mass ratio of the content of the adipate ester-based plasticizer with reference to the total content of the adipate ester-based plasticizer and the terephthalate ester-based plasticizer in the base film is 50-80 mass%. Even while using a replacement for alkyl phthalate esters as plasticizer, this semiconductor processing sheet exhibits a satisfactory flexibility and can suppress the occurrence of residues when peeled from an adherend.
Inventors:
NAKAMURA MASATOMO (JP)
ADACHI ISSEI (JP)
ADACHI ISSEI (JP)
Application Number:
PCT/JP2017/002514
Publication Date:
September 08, 2017
Filing Date:
January 25, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; H01L21/301; C09J201/00
Domestic Patent References:
| WO2014199992A1 | 2014-12-18 | |||
| WO2013080979A1 | 2013-06-06 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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