Title:
SEMICONDUCTOR PROCESSING SHEET
Document Type and Number:
WIPO Patent Application WO/2018/003312
Kind Code:
A1
Abstract:
A semiconductor processing sheet comprising at least a base material, wherein: the semiconductor processing sheet has a recovery rate of not less than 70% and not more than 100%; or the ratio of a 100% stress measured in an MD direction of the base material at 23°C to the 100% stress measured in a CD direction of the base material at 23°C is not less than 0.8 and not more than 1.2; or the tensile elasticity measured in the MD direction and the CD direction of the base material at 23°C is in each case not less than 10 MPa and not more than 350 MPa, the 100% stress measured in the MD direction and the CD direction of the base material at 23°C is in each case not less than 3 MPa and not more than 20 MPa, and the rupture elongation measured in the MD direction and the CD direction of the base material at 23°C is in each case not less than 100%. The semiconductor processing sheet can be greatly stretched, allowing semiconductor chips to be moved apart from each other sufficiently.
Inventors:
NAKAMURA MASATOMO (JP)
SAIKI NAOYA (JP)
ONO YOSHITOMO (JP)
SAIKI NAOYA (JP)
ONO YOSHITOMO (JP)
Application Number:
PCT/JP2017/017966
Publication Date:
January 04, 2018
Filing Date:
May 12, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J201/00; H01L21/56
Foreign References:
| JP2007063340A | 2007-03-15 | |||
| JPS62121781A | 1987-06-03 | |||
| JP2016062986A | 2016-04-25 | |||
| JP2008243858A | 2008-10-09 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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