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Title:
SEMICONDUCTOR PROTECTION FILM-FORMING FILM WITH DICING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/092804
Kind Code:
A1
Abstract:
Disclosed is a semiconductor protection film-forming film (14) with a dicing sheet, which protects a semiconductor element (18) that is mounted on a base and positioned on the outermost side.  The semiconductor protection film-forming film (14) with a dicing sheet comprises a protection film-forming layer (12) which is formed from a resin composition and protects a surface of the semiconductor element (18), said surface being on the reverse side of the surface mounted on the base, and a dicing sheet (13) which is laminated on the protection film-forming layer.

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Inventors:
HIRANO TAKASHI (JP)
YOSHIDA MASATO (JP)
Application Number:
PCT/JP2010/000810
Publication Date:
August 19, 2010
Filing Date:
February 10, 2010
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
HIRANO TAKASHI (JP)
YOSHIDA MASATO (JP)
International Classes:
H01L23/00; C08F290/06; H01L21/301
Foreign References:
JP2006140348A2006-06-01
JP2008248128A2008-10-16
JP2004214288A2004-07-29
JP2002280329A2002-09-27
JP2007053240A2007-03-01
JP2004043761A2004-02-12
JP2002280329A2002-09-27
JP2004214288A2004-07-29
JP2007250970A2007-09-27
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
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