Title:
SEMICONDUCTOR-SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/148628
Kind Code:
A1
Abstract:
The disclosed semiconductor-sealing resin composition contains a compound comprising the following esterified by a C5-25 alcohol in the presence of a compound represented by general formula (1): (A) an epoxy resin; (B) a hardener; (C) an inorganic filler; and (D) a copolymer of a C5-80 1-alkene and maleic anhydride. In general formula (1), R1 is a C1-5 alkyl group, a C1-5 alkyl halide group, or a C6-10 aromatic group.
Inventors:
TABEI, Jun-ichi (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
JP2011/002906
Publication Date:
December 01, 2011
Filing Date:
May 25, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
International Classes:
C08L63/00; C08F8/14; C08F210/14; C08K3/00; C08L23/26; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
HAYAMI, Shinji (Gotanda TG Bldg. 9F, 9-2 Nishi-Gotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
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Claims: