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Patent Searching and Data


Title:
SEMICONDUCTOR-SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/148628
Kind Code:
A1
Abstract:
The disclosed semiconductor-sealing resin composition contains a compound comprising the following esterified by a C5-25 alcohol in the presence of a compound represented by general formula (1): (A) an epoxy resin; (B) a hardener; (C) an inorganic filler; and (D) a copolymer of a C5-80 1-alkene and maleic anhydride. In general formula (1), R1 is a C1-5 alkyl group, a C1-5 alkyl halide group, or a C6-10 aromatic group.

Inventors:
TABEI JUN-ICHI (JP)
Application Number:
PCT/JP2011/002906
Publication Date:
December 01, 2011
Filing Date:
May 25, 2011
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
TABEI JUN-ICHI (JP)
International Classes:
C08L63/00; C08F8/14; C08F210/14; C08K3/00; C08L23/26; H01L23/29; H01L23/31; H01L25/065; H01L25/07; H01L25/18
Foreign References:
JP2001247748A2001-09-11
JP2003064239A2003-03-05
JP2005298647A2005-10-27
JP2005325159A2005-11-24
JP2006182913A2006-07-13
JP2008156665A2008-07-10
JP2002053649A2002-02-19
JPH0920821A1997-01-21
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
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Claims: