Title:
SEMICONDUCTOR-SEALING EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/030236
Kind Code:
A1
Abstract:
Provided is a semiconductor-sealing epoxy resin composition that satisfies required characteristics as a semiconductor sealing material, that does not produce odors, or NOx gas or SOx gas upon combustion, emits fluorescence even at long wavelengths of 390 nm or greater, and enables identification of semiconductor device types and manufacturers. This semiconductor-sealing epoxy resin composition comprises (A) an epoxy resin, (B) at least one type of agent selected from the group consisting of curing agents and curing accelerators, and (C) a fluorescer having an anthracene structure.
Inventors:
SASAGE NOZOMU (JP)
HOSONO YOHEI (JP)
HOSONO YOHEI (JP)
Application Number:
PCT/JP2021/026952
Publication Date:
February 10, 2022
Filing Date:
July 19, 2021
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/18; C08K3/013; C08L63/00; H01L23/29; H01L23/31
Foreign References:
| JP2012087103A | 2012-05-10 | |||
| JPH10311760A | 1998-11-24 | |||
| JP2012224723A | 2012-11-15 | |||
| JP2011231024A | 2011-11-17 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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