Title:
SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/254838
Kind Code:
A1
Abstract:
A semiconductor substrate (1) has formed therein a plurality of hollow structure bodies (3) in an array shape. The plurality of hollow structure bodies (3) each have: a detection part (4) having a hollow structure; and a getter part (5) having a hollow structure different from the detection part (4). A support body (6) demarcates the plurality of hollow structure bodies (3). The detection part (4) has a detection element (14) therein. The getter part (5) has a getter (16) therein. The detection part (4) and the getter part (5) are spatially connected to each other through a tunnel part (7) that is formed in the support body (6).
Inventors:
HANAOKA MISAKI (JP)
HATA HISATOSHI (JP)
HATA HISATOSHI (JP)
Application Number:
PCT/JP2022/008619
Publication Date:
December 08, 2022
Filing Date:
March 01, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01J1/02; B81B3/00; B81C1/00; H01L23/26; H01L27/144
Domestic Patent References:
| WO2005015637A1 | 2005-02-17 |
Foreign References:
| JPH09506712A | 1997-06-30 | |||
| JP2010216819A | 2010-09-30 | |||
| JP2017203737A | 2017-11-16 | |||
| JP2019504298A | 2019-02-14 | |||
| JP2017167131A | 2017-09-21 | |||
| JP2013036766A | 2013-02-21 | |||
| JP2011033393A | 2011-02-17 | |||
| JPH10239157A | 1998-09-11 | |||
| US20020175284A1 | 2002-11-28 |
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
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