Title:
SEMICONDUCTOR SENSOR AND METHOD OF PRODUCING SENSOR BODY FOR SEMICONDUCTOR SENSOR
Document Type and Number:
WIPO Patent Application WO/2007/072846
Kind Code:
A1
Abstract:
A semiconductor sensor having a reduced thickness and a method of producing a
sensor body for the semiconductor sensor. The length (L1) in the direction in
which the center line (C) of a portion at which a weight section (5) and an additional
weight section (3) are joined is set less than the length (L2) in the direction
in which the center line (C) of a support section (7) extends. The weight section
(5) and the additional weight section (3) are received in a space (15) surrounded
by the support section (7). The weight section (5) and the additional weight section
(3) are formed in dimensions and shapes that enable them to move in the space (15).
Inventors:
SAWAI TSUTOMU (JP)
KOMORI KAZUYA (JP)
KOMORI KAZUYA (JP)
Application Number:
PCT/JP2006/325345
Publication Date:
June 28, 2007
Filing Date:
December 20, 2006
Export Citation:
Assignee:
HOKURIKU ELECT IND (JP)
SAWAI TSUTOMU (JP)
KOMORI KAZUYA (JP)
SAWAI TSUTOMU (JP)
KOMORI KAZUYA (JP)
International Classes:
G01P15/02; H01L29/84
Domestic Patent References:
| WO2004114416A1 | 2004-12-29 |
Foreign References:
| JPH09184850A | 1997-07-15 | |||
| JPH09126876A | 1997-05-16 | |||
| JP2005049208A | 2005-02-24 | |||
| JPH06138141A | 1994-05-20 | |||
| JPH10132682A | 1998-05-22 | |||
| JPH05256869A | 1993-10-08 |
Attorney, Agent or Firm:
NISHIURA, Tsuguharu (25-5 Toranomon 1-chome, Minato-ku Tokyo01, JP)
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