Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR SENSOR
Document Type and Number:
WIPO Patent Application WO/2006/009194
Kind Code:
A1
Abstract:
There is provided a semiconductor sensor in which a diaphragm can be prevented from being damaged through movement of a weight even if the weight collides onto a semiconductor integrated circuit substrate, and the diaphragm section can be prevented from being bent significantly even if a semiconductor sensor element is contained in a warped case. The rear surface of the semiconductor integrated circuit substrate (7) is bonded onto the wall surface surrounding the containing chamber of the case (9). A supporting part of the semiconductor sensor element is bonded onto the surface (7a) of the semiconductor integrated circuit substrate (7). A shock absorbing layer (29) for suppressing bouncing of the weight (3) upon collision of the weight (3) is formed at least at a part on the surface (7a) of the semiconductor integrated circuit substrate (7) where the semiconductor sensor element (7) faces the weight (3).

Inventors:
TAMURA MASAHIDE (JP)
ANDO MASATO (JP)
ISHIKURO YUICHI (JP)
Application Number:
PCT/JP2005/013362
Publication Date:
January 26, 2006
Filing Date:
July 21, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOKURIKU ELECT IND (JP)
TAMURA MASAHIDE (JP)
ANDO MASATO (JP)
ISHIKURO YUICHI (JP)
International Classes:
G01C19/56; G01P15/08; G01P15/12; G01P9/04; (IPC1-7): G01P15/12; G01C19/56; G01P9/04; G01P15/08
Foreign References:
JP2003166998A2003-06-13
JP2003021647A2003-01-24
JPH05256869A1993-10-08
JPH02151770A1990-06-11
JPH0499964A1992-03-31
JPH09503298A1997-03-31
JPH0989925A1997-04-04
Other References:
See also references of EP 1777528A4
Attorney, Agent or Firm:
Nishiura, Tsuguharu (Toranomon 34 MT Building 9F 25-5, Toranomon 1-chom, Minato-ku Tokyo 01, JP)
Download PDF: