Title:
SEMICONDUCTOR SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/004326
Kind Code:
A1
Abstract:
A semiconductor sensor according to the present invention comprises: a substrate; a dielectric layer which is disposed on the substrate; a first electrode which is disposed on the dielectric layer; a second electrode which is disposed on the dielectric layer so as to leave a space with respect to the first electrode; a semiconductor sheet which is disposed between the first electrode and the second electrode on the dielectric layer and electrically connects the first electrode and the second electrode; a third electrode at least a part of which is covered by the dielectric layer, the third electrode facing the semiconductor sheet with the dielectric layer therebetween; and a plurality of first suction parts which are disposed on at least one of the surface of the third electrode and the dielectric layer disposed on the surface of the third electrode and which suction an object to be detected.
Inventors:
MIYAKAWA NARUTO (JP)
USHIBA SHOTA (JP)
SHINAGAWA AYUMI (JP)
OKA YUKA (JP)
KIMURA MASAHIKO (JP)
USHIBA SHOTA (JP)
SHINAGAWA AYUMI (JP)
OKA YUKA (JP)
KIMURA MASAHIKO (JP)
Application Number:
PCT/JP2021/022087
Publication Date:
January 06, 2022
Filing Date:
June 10, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01N27/414
Domestic Patent References:
| WO2011152211A1 | 2011-12-08 |
Foreign References:
| JP2017058320A | 2017-03-23 | |||
| JP2010151719A | 2010-07-08 | |||
| JP2008286714A | 2008-11-27 | |||
| JP2002296229A | 2002-10-09 | |||
| JP2012073101A | 2012-04-12 | |||
| JP2015190848A | 2015-11-02 | |||
| JP2005079342A | 2005-03-24 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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