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Title:
SEMICONDUCTOR SINGLE CRYSTAL INGOT SLICING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/167100
Kind Code:
A1
Abstract:
A semiconductor single crystal ingot slicing method comprising using a holding tool (14) to adhesively hold a cylindrically shaped semiconductor single crystal ingot (13) in a state rotated by a predetermined angle of rotation centered on a crystallographic axis of the ingot (13) that is different from the central axis of the ingot (13) cylinder, and, in this state, slicing the ingot (13) with a cutting device (16), wherein the predetermined rotation angle when the ingot (13) is adhesively held with the holding tool (14) and the tilting angle of the holding tool (14) owing to the cutting device (16) are determined in such a manner that the amount of warping in the wafer, which has been sliced by the cutting device (16), reaches a predetermined amount.

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Inventors:
NOGUCHI HIROSHI (JP)
Application Number:
PCT/JP2018/007074
Publication Date:
September 06, 2019
Filing Date:
February 27, 2018
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/304; B28D5/04
Foreign References:
JP2014195025A2014-10-09
JP2001050912A2001-02-23
JP2017024145A2017-02-02
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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