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Title:
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2011/074545
Kind Code:
A1
Abstract:
Disclosed are a semiconductor storage device and a method for manufacturing the semiconductor storage device, whereby the bit cost of memory using a variable resistance material is reduced. The semiconductor storage device has: a substrate; a first word line (2) which is provided above the substrate; a first laminated body, which is disposed above the first word line (2), and which has the N+1 (N≥1) number of first inter-gate insulating layers (11-15) and the N number of first semiconductor layers (21p-24p) alternately laminated in the height direction of the substrate; a first bit line (3), which extends in the direction that intersects the first word line (2), and which is disposed above the laminated body; a first gate insulating layer (9) which is provided on the side surfaces of the N+1 number of the first inter-gate insulating layers (11-15) and those of the N number of the first semiconductor layers (21p-24p); a first channel layer (8p) which is provided on the side surface of the first gate insulating layer (9); and a first variable resistance material layer (7) which is provided on the side surface of the first channel layer. The first variable material layer (7) is in a region where the first word line (2) and the first bit line (3) intersect each other. Furthermore, a polysilicon diode (PD) is used as a selection element.

Inventors:
SASAGO YOSHITAKA (JP)
SHIMA AKIO (JP)
HANZAWA SATORU (JP)
KOBAYASHI TAKASHI (JP)
KINOSHITA MASAHARU (JP)
TAKAURA NORIKATSU (JP)
Application Number:
PCT/JP2010/072398
Publication Date:
June 23, 2011
Filing Date:
December 13, 2010
Export Citation:
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Assignee:
HITACHI LTD (JP)
SASAGO YOSHITAKA (JP)
SHIMA AKIO (JP)
HANZAWA SATORU (JP)
KOBAYASHI TAKASHI (JP)
KINOSHITA MASAHARU (JP)
TAKAURA NORIKATSU (JP)
International Classes:
H01L27/105; H01L27/10; H01L45/00
Foreign References:
JP2008160004A2008-07-10
JP2007180389A2007-07-12
JP2008034456A2008-02-14
JP2009071313A2009-04-02
Other References:
H.TANAKA ET AL.: "Bit Cost scalable Technology with Punch and Plug Process", SYMPOSIUM ON VLSI TECHNOLOGY DIGEST OF TECHNICAL PAPERS, - 12 June 2007 (2007-06-12), pages 14 - 15
Attorney, Agent or Firm:
TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)
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