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Patent Searching and Data


Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/065889
Kind Code:
A1
Abstract:
Embodiments of the present invention relate to the technical field of semiconductors, and provide a semiconductor structure and a manufacturing method therefor. The semiconductor structure comprises: a substrate and a magnetic tunnel junction located on the substrate, wherein the direction from the substrate to the magnetic tunnel junction is a first direction, in a direction perpendicular to the first direction, the magnetic tunnel junction comprises a reference layer, a tunneling layer, a free layer, and a coverage layer which are arranged in sequence, the reference layer, the tunneling layer, the free layer, and the coverage layer all extend in the first direction, a magnetic moment direction of the reference layer is the first direction, and a spin magnetic moment direction of the free layer is changed in a plane parallel to the first direction; and a first data line, which is in contact with and connected to the coverage layer and is configured to control the spin magnetic moment direction of the free layer by means of the coverage layer. The embodiments of the present invention at least facilitate the improvement of the layout direction of film layers in a magnetic tunnel junction, so as to expand the space for change of a spin magnetic moment direction of a free layer, thereby facilitating the improvement of the electrical performance of the magnetic tunnel junction.

Inventors:
ZHENG YUHONG (CN)
WANG XIAOGUANG (CN)
XU HANDONG (CN)
Application Number:
PCT/CN2022/125424
Publication Date:
April 04, 2024
Filing Date:
October 14, 2022
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C11/16
Foreign References:
CN109841646A2019-06-04
US20140175577A12014-06-26
US20150021675A12015-01-22
US20190207084A12019-07-04
KR20090114681A2009-11-04
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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