Title:
SEMICONDUCTOR SUBSTRATE CLEANING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2022/014287
Kind Code:
A1
Abstract:
The present invention provides a semiconductor substrate cleaning solution that has excellent cleaning capability for a semiconductor substrate including a metal film after having undergone CMP, and has low surface roughness of the metal film after the cleaning. The semiconductor substrate cleaning solution according to the present invention is to be used for cleaning a semiconductor substrate and contains a compound represented by formula (1), a compound represented by formula (2), a primary amino alcohol having a primary amino group or a secondary amino group, a tertiary amine, and a solvent.
Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2021/023811
Publication Date:
January 20, 2022
Filing Date:
June 23, 2021
Export Citation:
Assignee:
FUJIFILM ELECTRONIC MAT CO LTD (JP)
International Classes:
C11D17/08; C11D1/62; C11D3/20; C11D3/30; C11D3/43; H01L21/304
Foreign References:
| JP2018503723A | 2018-02-08 | |||
| JP2006261432A | 2006-09-28 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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