Title:
SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/194133
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor substrate manufacturing method, for example, which prevents detachment and the like of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a circuit-formed surface of a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding a non-circuit-formed surface of the semiconductor wafer with the support material affixed thereto; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and a structure derived from diamine having an aliphatic chain, wherein an amine equivalent weight is 4000 to 20000.
Inventors:
KAMADA JUN
HARUTA KAICHIRO
UNEZAKI TAKASHI
IMAGAWA KIYOMI
FUJII KENICHI
KAYABA YASUHISA
KOHMURA KAZUO
HARUTA KAICHIRO
UNEZAKI TAKASHI
IMAGAWA KIYOMI
FUJII KENICHI
KAYABA YASUHISA
KOHMURA KAZUO
Application Number:
PCT/JP2018/016187
Publication Date:
October 25, 2018
Filing Date:
April 19, 2018
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
H01L21/56; C09J5/00; C09J179/08; H01L21/304; H01L23/12
Domestic Patent References:
| WO2014003056A1 | 2014-01-03 | |||
| WO2015053132A1 | 2015-04-16 | |||
| WO2013008437A1 | 2013-01-17 | |||
| WO2013183293A1 | 2013-12-12 | |||
| WO2014196296A1 | 2014-12-11 | |||
| WO2015033867A1 | 2015-03-12 | |||
| WO2013099173A1 | 2013-07-04 |
Foreign References:
| JP2016219511A | 2016-12-22 | |||
| JP2005116610A | 2005-04-28 | |||
| JP2016056060A | 2016-04-21 |
Attorney, Agent or Firm:
WASHIDA, Kimihito (JP)
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