Title:
SEMICONDUCTOR SUPPORTING GLASS SUBSTRATE AND LAMINATED SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/143583
Kind Code:
A1
Abstract:
The present invention addresses the technical problem of contributing to high-density mounting of a semiconductor package by devising a supporting glass substrate that resists dielectric breakdown in a semiconductor package production step. This semiconductor supporting glass substrate is characterized by including a first surface that is a side to which a semiconductor substrate is to be laminated, and a second surface that is a surface on a side opposite the first surface, and by including a roughened surface area having a surface roughness Ra of 0.3 nm or greater and a surface roughness Rmax of 100 nm or less on the first surface and/or the second surface.
Inventors:
YANASE TOMOKI (JP)
Application Number:
PCT/JP2016/056076
Publication Date:
September 15, 2016
Filing Date:
February 29, 2016
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03C19/00; H01L23/12; H01L21/02
Domestic Patent References:
| WO2013134237A1 | 2013-09-12 | |||
| WO2015037478A1 | 2015-03-19 | |||
| WO2016047210A1 | 2016-03-31 |
Foreign References:
| JP2010245084A | 2010-10-28 | |||
| JP2013237604A | 2013-11-28 | |||
| JP2012238894A | 2012-12-06 | |||
| JP2010070415A | 2010-04-02 | |||
| JP2013237115A | 2013-11-28 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
Kunihiko Shiromura (JP)
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