Title:
SEMICONDUCTOR SWITCH DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/069838
Kind Code:
A1
Abstract:
Provided is a semiconductor switch device which performs square integration of load current and wire temperature estimation at low cost and with high precision, while reducing resources required for accurate wire temperature estimation. A semiconductor switch device 200 according to one or more examples of the present invention includes: switch units 206, 201, and 202 that are connected between a power source 300 connected from the outside of the semiconductor switch device 200 and a load 400 through a wire, and that turn on/off power supply to the load; load current detection units 203 and 204 that detect load current flowing through the switch units 206, 201, and 202; and a square operation unit 205 that outputs a squared value of a load current value detected by the current detection units 203 and 204. The switch unit 206 receives a control command from outside and turns on/off power supply to the load on the basis of the control command.
Inventors:
OSAKA SHOHEI (JP)
SATO KIYOKATSU (JP)
SATO KIYOKATSU (JP)
Application Number:
PCT/JP2022/036397
Publication Date:
April 04, 2024
Filing Date:
September 29, 2022
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H02H3/08; H02H3/087
Foreign References:
| JP2009142146A | 2009-06-25 | |||
| JP2004333208A | 2004-11-25 | |||
| JP2009261088A | 2009-11-05 | |||
| JPH10116552A | 1998-05-06 |
Attorney, Agent or Firm:
OSAKA Masahiro (JP)
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