Title:
SEMICONDUCTOR TESTING DEVICE AND METHOD FOR EVALUATING PERFORMANCE OF SEMICONDUCTOR TESTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/218783
Kind Code:
A1
Abstract:
A semiconductor testing device (1) is configured so that it is possible to test electrical properties of a semiconductor element (70), the semiconductor testing device (1) conducting a performance evaluation by using a test element (60) which simulates the semiconductor element (70). The semiconductor testing device (1) comprises: a stage (10) for fixing a semiconductor element; a stage electrode (12) that is provided to the stage (10) and connects to a positive electrode (62); a voltage sensor (30) that detects a voltage between the positive electrode (62) and a negative electrode (65); a power source (40) that supplies a current between the positive electrode (62) and the negative electrode (65); and a current sensor (50) that detects a current between the positive electrode (62) and a negative electrode sense electrode (66).
Inventors:
NAKANISHI GAKU (JP)
NONOMURA MASAYA (JP)
NONOMURA MASAYA (JP)
Application Number:
PCT/JP2023/012568
Publication Date:
November 16, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01R31/26
Domestic Patent References:
WO2018092457A1 | 2018-05-24 |
Foreign References:
JP2016161333A | 2016-09-05 | |||
JP2014225607A | 2014-12-04 | |||
JP2021029765A | 2021-03-01 | |||
JP2013183988A | 2013-09-19 | |||
JP2010004959A | 2010-01-14 | |||
JP2016111207A | 2016-06-20 | |||
JP2015132476A | 2015-07-23 | |||
JP2017020811A | 2017-01-26 | |||
JP2021175962A | 2021-11-04 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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