Title:
SEMICONDUCTOR TRANSPORT MEMBER AND SEMICONDUCTOR CARRYING MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/027803
Kind Code:
A1
Abstract:
Provided is a semiconductor transport member that includes a semiconductor carrying member having a strong gripping force and less susceptible to contaminants adhering to and remaining on the semiconductor side thereof. Further provided is a semiconductor carrying member having a strong gripping force and less susceptible to contaminants adhering to and remaining on the semiconductor side thereof. This semiconductor transport member includes a transport substrate and a semiconductor carrying member, wherein the semiconductor carrying member has a fibrous columnar structure, the fibrous columnar structure is provided with a plurality of fibrous columns, the fibrous columns are oriented substantially perpendicular to the transport substrate, and the surface of the fibrous columnar structure on the side opposite from the transport substrate side thereof has a static friction coefficient of at least 2.0 with respect to a glass surface.
Inventors:
MAENO YOUHEI (JP)
Application Number:
PCT/JP2015/073129
Publication Date:
February 25, 2016
Filing Date:
August 18, 2015
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/677; B82B1/00; C01B31/02; H01L21/683
Domestic Patent References:
| WO2013090898A1 | 2013-06-20 | |||
| WO2011077785A1 | 2011-06-30 |
Foreign References:
| JP2014098107A | 2014-05-29 |
Other References:
HIROKI NAKANISHI ET AL.: "Capture System for Space Plane-Structure with High Friction Material", ROBOTICS MECHATRONICS KOENKAI 2013 KOEN RONBUNSHU, 21 May 2013 (2013-05-21), pages 1 - 4
Attorney, Agent or Firm:
MOMII, Takafumi (JP)
Takafumi Momii (JP)
Takafumi Momii (JP)
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