Title:
SEMICONDUCTOR WAFER CARRIER CONTAINER
Document Type and Number:
WIPO Patent Application WO/2005/057649
Kind Code:
A1
Abstract:
A semiconductor wafer carrier container constituted of a container body (1) in which a semiconductor wafer carrier is placed and a cover (2) for covering the container body (1). The container body (1) is made by forming a resin composite (A) made from a thermoplastic resin (a1) and carbon fibers (a2). The surface resistivity of the container body (1) is 102 to 1012 &ohm /&square . The cover is made by forming a resin composite (B) made from a thermoplastic resin (b1) and an antistatic agent (b2) as an organic compound. The surface resistivity of the cover (2) is 103 to 1013 &ohm /&square , and the cover (2) is transparent. The semiconductor wafer carrier container has excellent antistatic characteristics, has excellent anti-pollution characteristics, has excellent anti-abrasion characteristics, and has excellent visibility to the inside.
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Inventors:
SAKAMOTO TAKAKI (JP)
SHIRAGA JUN (JP)
KOBAYASHI TAKAYUKI (JP)
KONNAI NORIYUKI (JP)
SHIRAGA JUN (JP)
KOBAYASHI TAKAYUKI (JP)
KONNAI NORIYUKI (JP)
Application Number:
PCT/JP2004/018268
Publication Date:
June 23, 2005
Filing Date:
December 08, 2004
Export Citation:
Assignee:
FUJI BAKELITE CO LTD (JP)
SAKAMOTO TAKAKI (JP)
SHIRAGA JUN (JP)
KOBAYASHI TAKAYUKI (JP)
KONNAI NORIYUKI (JP)
SAKAMOTO TAKAKI (JP)
SHIRAGA JUN (JP)
KOBAYASHI TAKAYUKI (JP)
KONNAI NORIYUKI (JP)
International Classes:
B65D85/86; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65D85/86
Foreign References:
JPH057680U | 1993-02-02 | |||
JP2000306988A | 2000-11-02 | |||
JPS61195059U | 1986-12-04 | |||
JP2002305239A | 2002-10-18 | |||
JPH10245066A | 1998-09-14 | |||
JPS54124969A | 1979-09-28 |
Attorney, Agent or Firm:
Mori, Hirosaburo (Ohjima Kurashiki-shi, Okayama 47, JP)
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